MITXPC Dynatron LGA4189 Copper Heatpipe vs MITXPC Dynatron 1U AM4 Copper (2026): Key Differences
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You are comparing the mitxpc dynatron n2 intel lga4189 vs dynatron a37 amd ryzen. Both units use copper for heat transfer and target server environments. The main difference lies in their cooling method and socket support. The N2 uses active airflow with heat pipes for Intel LGA4189. The A37 is a passive copper block for AMD AM4. Each design serves a specific hardware requirement.
Key differences
| Aspect | Dynatron LGA4189 Copper Heatpipe Heatsink | Dynatron 1U AM4 Copper Passive Heatsink |
|---|---|---|
| Socket Compatibility | FCLGA4189 | AM4 |
| Cooling Method | Active (23CFM airflow) | Passive |
| Material Composition | Aluminum base with copper heat pipes | Copper |
| TDP Support | Up to 270W | Not listed |
Which one should you choose?
Choose Dynatron LGA4189 Copper Heatpipe Heatsink if
- You need to cool an Intel Ice Lake or Cooper Lake processor.
- Your server chassis provides forced airflow for active cooling.
- You require support for high TDP loads up to 270W.
Choose Dynatron 1U AM4 Copper Passive Heatsink if
- You are building an AMD Ryzen AM4 server system.
- You prefer a silent passive cooling solution without fans.
- You want a compact 1U heatsink made entirely of copper.
Verdict: Choose the N2 if you are using Intel LGA4189 CPUs and have airflow available. Pick the A37 for AMD AM4 platforms where silence and pure copper construction matter. The right choice depends entirely on your processor socket and airflow setup.
Dynatron LGA4189 vs Dynatron AM4
Socket Compatibility
The Dynatron LGA4189 Copper Heatpipe Heatsink supports the FCLGA4189 socket, designed for Intel Ice Lake and Cooper Lake processors. This makes it suitable for specific server workloads requiring that interface. The Dynatron 1U AM4 Copper Passive Heatsink is built for AMD Ryzen AM4 sockets. You must choose the model that matches your CPU socket. Neither unit supports cross-platform use. Selecting the wrong socket type will prevent installation. Check your processor specification before purchasing either heatsink to ensure physical and electrical compatibility with your motherboard.
Cooling Method
Active cooling defines the Dynatron LGA4189 Copper Heatpipe Heatsink. It relies on airflow, specified at 23CFM, to dissipate heat from the aluminum base and copper heatpipes. This approach handles higher thermal loads. The Dynatron 1U AM4 Copper Passive Heatsink uses a passive cooling method. It has no fans and depends entirely on chassis airflow or external vents. Passive designs are quieter but require careful case airflow planning. Your system must provide sufficient air movement for the passive unit to function effectively, whereas the active unit drives its own cooling.
Thermal Design Power
The Dynatron LGA4189 Copper Heatpipe Heatsink supports up to 270W TDP. This rating indicates it can manage significant heat output from high-performance server CPUs. The Dynatron 1U AM4 Copper Passive Heatsink does not list a specific TDP rating in its published specifications. Passive cooling typically suits lower power processors or systems with strong case ventilation. If your AMD Ryzen processor has a high TDP, the passive unit may struggle without exceptional airflow. The active unit offers a clear advantage for high-power Intel server chips.
Material Construction
Both units utilize copper for efficient heat transfer, but their construction differs. The Dynatron LGA4189 Copper Heatpipe Heatsink combines an aluminum base and stacked fins with copper heatpipes. This hybrid design balances weight and conductivity. The Dynatron 1U AM4 Copper Passive Heatsink is constructed entirely from copper. A pure copper block offers high thermal mass and conductivity but adds weight. The all-copper design of the AM4 unit may provide consistent heat spreading, while the N2 uses heat pipes to move heat away from the base to the fins.
Mounting System
The Dynatron LGA4189 Copper Heatpipe Heatsink uses Intel Standard Anti-Tilt Rotating Heatsink Captive Mounting Sets. This system secures the heatsink firmly while preventing tilt during installation. The Dynatron 1U AM4 Copper Passive Heatsink does not list its specific mounting mechanism in the provided data. You must verify if it uses standard AM4 backplates or proprietary brackets. The N2 offers a defined mounting solution for Intel sockets. For the AM4 unit, you need to check the manual for mounting details to ensure it fits your server chassis and motherboard.
Dimensions
The Dynatron 1U AM4 Copper Passive Heatsink has explicit dimensions of 5 x 3 x 1 inches. Its 1U server height makes it compact and suitable for low-profile server racks. The Dynatron LGA4189 Copper Heatpipe Heatsink does not list its physical dimensions in the data. You must verify its height and footprint to ensure it fits your Intel server chassis. The AM4 unit offers clear size specifications for planning rack space. Without dimensions for the N2, you cannot compare their physical footprint directly based on the available data.
Thermal Grease
The Dynatron LGA4189 Copper Heatpipe Heatsink comes with pre-printed Shin-Etsu 7762 Thermal Grease. This ensures proper thermal contact between the heatsink base and the CPU out of the box. The Dynatron 1U AM4 Copper Passive Heatsink does not mention pre-applied thermal grease in its specifications. You may need to apply thermal paste separately if it is not included. The N2 provides a ready-to-install solution with known grease quality. For the AM4 unit, verify if thermal compound is included or if you must supply your own for optimal heat transfer.
Choose Your MITXPC Dynatron Cooler
Intel Ice Lake or Cooper Lake server admins
You need active cooling for FCLGA4189 sockets. This unit supports up to 270W TDP with 23CFM airflow. It uses an aluminum base and copper heatpipes. Shin-Etsu 7762 thermal grease is pre-applied. The captive mounting set ensures secure installation in your server chassis.
AMD Ryzen AM4 passive cooling users
You require a passive solution for AM4 processors. This 1U heatsink is made entirely of copper. Its compact dimensions measure 5 by 3 by 1 inches. It relies on case airflow rather than a fan. This design suits quiet server environments where noise is a concern.
High performance Intel server builders
You need to dissipate significant heat from high-TDP CPUs. The Dynatron N2 handles 270W with forced air. Copper heatpipes transfer heat efficiently to the aluminum fins. Pre-printed thermal paste simplifies setup. The rotating captive mount provides stability for demanding workloads in data centers.
The products compared
Dynatron LGA4189 Copper Heatpipe Heatsink
Best for: Intel LGA4189 server passive cooling
- Socket Compatibility
- FCLGA4189
- Material
- Aluminum Base, Copper Heatpipes
- Mounting Type
- Captive Mounting Sets
View on Amazon: Dynatron LGA4189 Copper Heatpipe Heatsink Affiliate link
The MITXPC Dynatron N2 is a passive 1U server heatsink designed for Intel FCLGA4189 sockets, including Ice Lake and Cooper Lake processors. It uses an aluminum base with stacked fins and copper heatpipes to handle up to 270W TDP. The unit includes pre-printed Shin-Etsu 7762 thermal grease and uses standard captive mounting sets. It suits systems requiring reliable passive cooling for high-performance server CPUs.
Pros
- Supports up to 270W TDP
- Copper heatpipes with aluminum base
- Pre-printed Shin-Etsu 7762 thermal grease
- Compatible with FCLGA4189 sockets
Cons
- Passive design requires external airflow
- Limited to 23CFM airflow rating
- Only supports Intel LGA4189 sockets
Good fit if
- You use Intel Ice Lake or Cooper Lake CPUs
- You need a 1U server cooling solution
- You want pre-applied thermal grease
Skip if
- You use AMD Ryzen processors
- You need active fan cooling
- You require support for other socket types
Verdict: The MITXPC Dynatron N2 LGA4189 Copper Heatsink is a specialized passive cooler for Intel FCLGA4189 server platforms. It fits builds needing high TDP handling without active fans.
Dynatron 1U AM4 Copper Passive Heatsink
Best for: 1U AMD Ryzen server chassis with forced airflow
- Socket Compatibility
- AM4
- Material
- Copper
- Server Height
- 1U
- Cooling Method
- Passive
- Dimensions
- 5 x 3 x 1 inches
- System Type
- Server
View on Amazon: Dynatron 1U AM4 Copper Passive Heatsink Affiliate link
The MITXPC Dynatron A37 is a passive 1U server heatsink designed for AMD Ryzen AM4 sockets. It is built entirely from copper and measures 5 x 3 x 1 inches. This compact design fits standard 1U server racks. You need active airflow to move heat away from the CPU. It suits low-power systems that rely on case fans for cooling.
Pros
- Built from solid copper for efficient heat transfer
- Compact 1U height fits tight server racks
- Compatible with AMD AM4 sockets
- Dimensions are 5 x 3 x 1 inches
Cons
- Passive cooling requires strong case airflow
- Only supports AM4 sockets
- No fan included for active cooling
Good fit if
- You are building a 1U server chassis
- You use an AMD Ryzen AM4 processor
- You have high-static pressure fans for passive cooling
Skip if
- You need active cooling without case fans
- You use an Intel LGA4189 socket
- You require aluminum construction for weight savings
Verdict: The MITXPC Dynatron A37 AM4 Copper 1U is a specialized passive heatsink for AMD Ryzen builds in 1U racks. It fits users who can provide dedicated airflow for passive dissipation.
Specifications side by side
| Spec | Dynatron LGA4189 Copper Heatpipe Heatsink | Dynatron 1U AM4 Copper Passive Heatsink |
|---|---|---|
| Socket Compatibility | FCLGA4189 | AM4 |
| Material | Aluminum Base, Copper Heatpipes | Copper |
| Server Height | not stated | 1U |
| Cooling Method | not stated | Passive |
| Dimensions | not stated | 5 x 3 x 1 inches |
| Mounting Type | Captive Mounting Sets | not stated |
| System Type | not stated | Server |
| Model | not stated | A37 |
Frequently asked questions
Does the Dynatron LGA4189 use active or passive cooling?
The Dynatron LGA4189 Copper Heatpipe Heatsink is designed for active cooling. It relies on forced airflow to dissipate heat effectively. This approach allows it to handle higher thermal loads in server environments. You should ensure your chassis provides adequate fan support for this unit to function properly.
Is the Dynatron 1U AM4 a passive cooler?
Yes, the Dynatron 1U AM4 Copper Passive Heatsink uses a passive cooling method. It does not include built-in fans. Instead, it depends on external airflow from your server chassis to cool the CPU. This design suits 1U rack systems where dedicated airflow is available.
What materials are used in the Dynatron LGA4189 heatsink?
The Dynatron LGA4189 Copper Heatpipe Heatsink is constructed from copper and aluminum. These materials are chosen for their efficient heat transfer properties. The combination helps move heat away from the processor core quickly. This construction supports its role in high-performance server applications.
Does the Dynatron 1U AM4 heatsink include a fan?
No, the Dynatron 1U AM4 Copper Passive Heatsink does not include a fan. It is a passive unit that requires external air movement. You must provide airflow through your server case to maintain safe operating temperatures. This makes it ideal for setups with strong case fans.
What is the height of the Dynatron 1U AM4 heatsink?
The Dynatron 1U AM4 Copper Passive Heatsink has a height of 1 inch. This low profile is essential for 1U server chassis compatibility. It ensures the cooler fits within the strict height constraints of rack-mounted systems. Check your case clearance before installation.
Which socket does the Dynatron LGA4189 support?
The Dynatron LGA4189 Copper Heatpipe Heatsink supports the FCLGA4189 socket. This interface is used by specific Intel server processors. It is not compatible with AMD or consumer Intel sockets. Verify your motherboard socket type before purchasing to ensure proper fit.
Can the Dynatron 1U AM4 heatsink fit in a standard desktop case?
The Dynatron 1U AM4 Copper Passive Heatsink is designed for 1U server systems. Its dimensions and passive nature make it less suitable for standard desktop cases. Standard cases often lack the directed airflow needed for passive cooling. Consider active coolers for typical desktop builds.