The Best Dynatron Heatsinks in 2026: 15 Picks
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Finding the best dynatron heatsinks requires matching your processor socket with your server chassis dimensions. Dynatron offers compact 1U and 2U form factors in active and passive designs, featuring copper or aluminum materials, integrated blower fans, and vapor chambers.
The Dynatron Copper LGA1156 Blower Heatsink takes the top position because its 1.12-inch all-copper design provides dedicated cooling for low-profile Intel Socket LGA1156 builds. This guide compares 15 products based strictly on the specifications published on their listings, helping you assess dimensions, socket support, and cooling methods for your setup.
Quick picks
Our 15 picks
Dynatron Copper LGA1156 Blower Heatsink
Best for: low-profile Intel Socket LGA1156 builds
- Socket Compatibility
- LGA1156
- Material
- Copper
- Compatible Device
- Intel i5 & i7 CPUs
- Fan Size
- 3-inch
- Dimensions
- 3.35 x 3.21 x 1.12 inches
- Features
- Fan
This Dynatron cooler pairs a pure copper heatsink with an integrated three-inch double ball bearing blower fan. Measuring 1.12 inches high, 3.35 inches long, and 3.21 inches wide, it weighs 12.5 ounces. It connects via a 4-pin power header to cool Intel Core i5 and i7 processors on Socket LGA1156 motherboards. You will find it fits compact chassis that need active copper cooling in low vertical spaces.
Pros
- All-copper heatsink construction
- Low vertical height of 1.12 inches
- Integrated 3-inch double ball bearing blower fan
- Standard 4-pin power connector
Cons
- Socket support limited strictly to LGA1156
- Compatibility listed only for Intel Core i5 and i7 CPUs
Good fit if
- You need a low-clearance cooler measuring 1.12 inches tall.
- You run an Intel Core i5 or i7 CPU on Socket LGA1156.
- You prefer an all-copper heatsink with an active blower fan.
Skip if
- You use an AMD processor or a different Intel socket.
- You require a fanless passive heatsink design.
Verdict: Dynatron Copper Heatsink with Blower Fan delivers compact all-copper cooling for Socket LGA1156 systems. Its 1.12-inch profile makes it a direct fit for space-constrained builds using compatible Intel Core processors.
Dynatron 1U Active Copper Heatsink
Best for: 1U Intel LGA 1155 server builds
- Socket Compatibility
- LGA1155, LGA1156
- Material
- Copper
- Server Height
- 1U
- Cooling Method
- Active
- Dimensions
- 5 x 5 x 2.5 inches
- Features
- Fan
This Dynatron 1U Active Copper CPU Cooler provides dedicated thermal management for legacy Intel server platforms. Built with a solid copper heatsink and an integrated active dual ball-bearing cooling fan, it fits 1U rackmount enclosures with a height profile of 2.5 inches. It targets LGA 1155 and LGA 1156 sockets, supporting Intel Xeon 3400 series and Core processors. You get a direct-fit cooling setup designed specifically for compact rack hardware.
Pros
- Solid copper heatsink material
- Dual ball bearing active cooling fan
- Compact 2.5-inch height profile for 1U server chassis
- Direct LGA 1155 and LGA 1156 socket compatibility
Cons
- Socket support limited strictly to LGA 1155 and LGA 1156
- Heatsink weight reaches 15.2 ounces
Good fit if
- You run an Intel LGA 1155 or LGA 1156 server processor.
- You need an active copper cooler suited for 1U server enclosures.
Skip if
- You use modern Intel sockets like LGA 1700 or LGA 2011.
- You require a passive heatsink solution without a fan.
Verdict: Dynatron 1U Active Copper CPU Cooler delivers active all-copper heat dissipation for LGA 1155 and LGA 1156 server configurations. It fits 1U chassis deployments that need compact dimensions and ball-bearing fan cooling.
Dynatron 1U Copper Blower Heatsink
Best for: 1U Intel Socket 2011 Narrow ILM builds
- Socket Compatibility
- Intel Socket 2011 (Narrow ILM)
- Material
- Copper1100
- Server Height
- 1U
- Mounting Type
- Captive Mounting
- Dimensions
- 4.06 × 3.15 × 1.1 inches
- Weight
- 1.04 pounds
This 1U active server cooler features a solid Copper1100 heatsink with skived fins and an integrated alloy frame PWM blower. Built specifically for Intel Socket 2011 with Narrow ILM mounting, it measures 1.1 inches tall to fit compact rackmount chassis. Pre-applied Shin-Etsu G751 thermal grease and captive mounting screws simplify installation. You will find it handles processors rated up to 95 watts in dense server enclosures.
Pros
- Copper1100 heatsink with skiving fins
- Compact 1.1-inch height for 1U rackmount chassis
- Alloy frame blower with PWM speed control
- Pre-printed Shin-Etsu G751 thermal grease
- Captive mounting hardware for secure attachment
Cons
- Maximum CPU power support capped at 95 watts
- Limited exclusively to Intel Socket 2011 Narrow ILM
- Weighs 1.04 pounds despite small footprint
Good fit if
- You need a 1U active cooler for Intel Socket 2011 Narrow ILM motherboards.
- You run a server processor operating at or below 95 watts.
- You want pre-applied thermal grease and captive mounting screws.
Skip if
- You run a processor requiring more than 95 watts of cooling capacity.
- You use a motherboard with standard Square ILM or a different socket.
Verdict: Dynatron 1U Copper Narrow LGA 2011 Cooler delivers active cooling in a compact 1.1-inch profile using skived Copper1100 fins and an alloy blower. It suits 1U server deployments running sub-95W Narrow ILM processors.
Dynatron 1U Passive Vapor Chamber Heatsink
Best for: 1U Narrow ILM LGA 2011 rack servers
- Socket Compatibility
- Narrow ILM Socket LGA2011
- Material
- Copper, Aluminum
- Server Height
- 1U
- Cooling Method
- Passive
- Dimensions
- 5.2 x 2.4 x 4.5 inches
- Mounting Type
- Captive screw
This Dynatron heatsink is a 1U passive cooling solution built for servers with Narrow ILM Socket LGA 2011 processors. It features a copper vapor chamber base paired with stacked aluminum fins to handle up to 165 watts of TDP. Captive screw mounting and pre-applied Shin-Etsu 7762 thermal grease simplify installation. It suits you if you maintain high-density rackmount chassis that use directed system airflow instead of active onboard cooler fans.
Pros
- Dissipates heat for processors up to 165W TDP
- Copper vapor chamber base with aluminum stacked fins
- Includes pre-printed Shin-Etsu 7762 thermal grease
- Captive screw mounting mechanism
Cons
- Passive design requires existing chassis airflow to cool
- Restricted to Narrow ILM Socket LGA 2011 motherboards
Good fit if
- You run a 1U rackmount chassis with dedicated chassis fan ducts.
- You use an Intel processor on a Narrow ILM Socket LGA 2011 board.
- You need a heatsink rated for thermal loads up to 165 watts.
Skip if
- You need an active heatsink with an integrated fan.
- You have a square ILM or modern desktop processor socket.
Verdict: Dynatron 1U Narrow LGA 2011 Passive Heatsink delivers 165W TDP dissipation for slim rack enclosures using a copper vapor chamber and aluminum fins. It provides a straightforward passive fit for Narrow ILM LGA 2011 server setups.
Dynatron 1U Active AM4 Copper Heatsink
Best for: 1U server builds using AMD Socket AM4
- Socket Compatibility
- AMD Socket AM4
- Material
- Copper
- Server Height
- 1U
- Cooling Method
- Active
- Dimensions
- 5 x 3 x 1 inches
- Weight
- 1.1 pounds
The Dynatron 1U Active Copper AM4 Cooler gives you an active cooling setup designed specifically for AMD Socket AM4 motherboards. At 1 inch tall, 3 inches wide, and 5 inches long, it fits into compact 1U server chassis configurations. Its all-copper fin construction paired with an integrated active PWM blower keeps air moving through dense rack mounts. This unit suits you if you run low-profile rackmount systems requiring dedicated AM4 socket cooling.
Pros
- Fits 1U server chassis heights with a 1-inch total profile
- Built with pure copper fins for heat dissipation
- Equipped with an integrated active PWM blower
- Direct native support for AMD Socket AM4 motherboards
Cons
- Only compatible with AMD Socket AM4 processors
- Weighs 1.1 pounds despite its compact 5-by-3-inch footprint
Good fit if
- You need an active heatsink that fits within 1U chassis clearance
- You use an AMD Socket AM4 motherboard in a server enclosure
Skip if
- You are building an Intel-based or AMD SP3 server platform
- You prefer a fanless passive heatsink design
Verdict: Dynatron 1U Active Copper AM4 Cooler provides active blower cooling and copper construction for 1U AMD AM4 server builds. Its slim 1-inch height ensures dependable clearance in dense rack-mounted environments.
Dynatron 1U Passive Copper Heatsink
Best for: 1U AMD EPYC SP3 rackmount servers
- Socket Compatibility
- SP3
- Material
- Copper 1100
- Server Height
- 1U
- Cooling Method
- Passive
- Compatible Device
- AMD EPYC
- Dimensions
- 4.4 × 3 × 1 inches
This Dynatron heatsink is a 1U passive cooling block designed for AMD EPYC processors on socket SP3. It measures 1 inch high, 3 inches wide, and 4.4 inches long, fitting inside compact 1U server chassis. Constructed from Copper 1100 with skived fins, it weighs 1.3 pounds and includes pre-printed Shin-Etsu 7762 thermal grease. It suits you if your server chassis supplies directed internal fan airflow.
Pros
- Dense Copper 1100 skived fin construction
- Low 1-inch height fits 1U server enclosures
- Pre-printed Shin-Etsu 7762 thermal compound included
- Tailored for AMD EPYC socket SP3 processors
Cons
- Passive design requires separate system airflow
- Limited exclusively to AMD socket SP3
Good fit if
- You run an AMD EPYC processor on socket SP3.
- You need a heatsink that clears 1U server rack dimensions.
Skip if
- You need an active heatsink with an onboard fan.
- You use an Intel server socket or non-SP3 platform.
Verdict: Dynatron 1U Passive Copper EPYC SP3 Heatsink delivers a low-profile, pure-copper thermal block for dense SP3 server deployments. It provides passive heat transfer when supported by sufficient chassis airflow.
Dynatron 2U Active Aluminum SP3 Heatsink
Best for: AMD EPYC Socket SP3 2U servers
- Socket Compatibility
- Socket SP3
- Material
- Aluminum
- Server Height
- 2U
- Cooling Method
- Active
- Compatible Device
- AMD EPYC
- Dimensions
- 5 × 4.5 × 6 inches
This Dynatron active cooler pairs an aluminum fin array with embedded heatpipes for server builds. Designed specifically for AMD EPYC processors on Socket SP3, it fits standard 2U chassis configurations. You get dedicated active cooling in a lightweight one-pound design measuring five inches long and 4.5 inches wide. It suits system builders who need direct active airflow over an SP3 socket without the heavier mass of full copper.
Pros
- Embedded heatpipes for heat transfer
- Active cooling configuration
- Lightweight 1-pound aluminum build
- Designed for 2U server height
Cons
- Limited strictly to AMD Socket SP3
- Lacks support for Intel processor sockets
Good fit if
- You deploy AMD EPYC CPUs on Socket SP3.
- You configure a 2U server chassis.
- You want an active cooler with embedded heatpipes.
Skip if
- You run Intel Xeon or consumer desktop hardware.
- You require a compact 1U form factor cooler.
- You need a passive heatsink for ducted air.
Verdict: Dynatron 2U Active Aluminum Server Cooler delivers targeted active airflow and embedded heatpipes for AMD EPYC processors on Socket SP3. It provides a lightweight cooling option specifically fitted for 2U server enclosures.
Dynatron 1U Copper Vapor Chamber Server Heatsink
Best for: 1U Intel FCLGA 3647 server racks
- Socket Compatibility
- FCLGA 3647 Narrow ILM
- Material
- Copper with vapor chamber base
- Server Height
- 1U
- Dimensions
- 108.0 x 81.0 x 27.0 mm
- System Type
- Server
- Weight
- 1.06 pounds
View on Amazon: Dynatron 1U Copper Vapor Chamber Server Heatsink
This Dynatron passive cooler fits 1U server chassis and targets Intel Xeon Platinum and Gold processors. You get a compact profile measuring 108.0 by 81.0 by 27.0 mm, designed specifically for FCLGA 3647 Narrow ILM sockets. Its build combines a vapor chamber base with copper stacked fins to transfer heat across a 1.06-pound frame. This unit suits you if you run high-density enterprise rack hardware with existing system ducting.
Pros
- Compact 27.0 mm height fits standard 1U rackmount enclosures
- Vapor chamber base paired with stacked copper fins
- Direct mounting for Intel FCLGA 3647 Narrow ILM sockets
- Solid copper construction weighing 1.06 pounds
Cons
- Only mounts to FCLGA 3647 Narrow ILM sockets
- No integrated fan included, requiring active server chassis airflow
Good fit if
- You install an Intel Xeon Platinum or Gold CPU on an FCLGA 3647 Narrow ILM socket.
- You configure a slim 1U server chassis with internal blower or fan ventilation.
Skip if
- You use an AMD processor or a Square ILM socket configuration.
- You need a standalone cooler with an integrated cooling fan.
Verdict: Dynatron 1U Narrow LGA 3647 Copper Heatsink delivers a low-profile 27 mm copper heatsink built strictly for high-density 1U servers with Narrow ILM Intel sockets. It relies entirely on external chassis airflow to cool Xeon Platinum and Gold processors.
Dynatron 1U Copper Vapor Chamber Server Heatsink
Best for: 1U AMD EPYC Socket SP3 rackmount servers
- Socket Compatibility
- SP3
- Material
- Copper 1100 with Skiving Fin
- Server Height
- 1U
- Compatible Device
- AMD EPYC
- Dimensions
- 120 x 82 x 27 mm
- System Type
- Server
View on Amazon: Dynatron 1U Copper Vapor Chamber Server Heatsink
This heatsink is built for 1U server chassis and fits AMD EPYC processors on Socket SP3. At 27 mm tall, 120 mm long, and 82 mm wide, it matches tight vertical clearance requirements. The unit combines a vapor chamber base with Copper 1100 skived fins to conduct heat away from the processor. You get a dense 1.01-pound copper design intended for rackmount server systems with high airflow.
Pros
- Low 27 mm height fits standard 1U server enclosures
- Equipped with a vapor chamber base
- Constructed from Copper 1100 with skiving fins
- Dedicated fit for AMD EPYC Socket SP3 systems
Cons
- Compatible only with AMD Socket SP3 motherboards
- Does not include an integrated cooling fan
Good fit if
- You need a heatsink under 28 mm for a 1U server chassis.
- You run an AMD EPYC CPU on Socket SP3.
- You want a pure copper unit with a vapor chamber base.
Skip if
- You use Intel processors or non-SP3 AMD sockets.
- You need a heatsink with a pre-installed cooling fan.
Verdict: Dynatron 1U Socket SP3 Copper Heatsink provides a compact 27 mm vapor chamber design engineered for AMD EPYC server nodes. Its Copper 1100 construction delivers efficient thermal transfer inside chassis featuring directed rack airflow.
Dynatron 2U Active CPU Cooler
Best for: 2U server chassis requiring active cooling
- Material
- Aluminum Heatsink with Heatpipe
- Server Height
- 2U
- Cooling Method
- Active
- Fan Size
- 60mm
- Dimensions
- 4.25 × 3.15 × 2.6 inches
- Weight
- 1 pounds
This Dynatron 2U active server heatsink gives you a compact cooling unit designed for 2U chassis environments. It features an aluminum heatsink with embedded heat pipes, paired with an integrated 60mm two ball bearing fan to drive airflow across the assembly. You also receive pre-applied Shin-Etsu 7762 thermal compound directly on the base. It suits your build if you need a self-contained active cooler measuring 2.6 inches tall.
Pros
- Embedded heat pipe inside aluminum fin heatsink
- Dual ball bearing 60mm cooling fan
- Pre-applied Shin-Etsu 7762 thermal compound
- Compact 2.6-inch height fits 2U server enclosures
Cons
- Socket compatibility details omitted from manufacturer specifications
- 60mm fan profile moves less air than larger chassis fans
Good fit if
- You need an active cooler built for 2U server chassis.
- You want pre-printed Shin-Etsu 7762 thermal compound ready on the base.
- You need a dual ball bearing 60mm fan integrated on the heatsink.
Skip if
- You need a low-profile 1U server heatsink.
- You need a passive heatsink designed for external duct airflow.
Verdict: Dynatron 2U Active Server CPU Cooler delivers integrated 60mm fan cooling and embedded heatpipes for 2U server setups. Pre-printed Shin-Etsu 7762 compound ensures straightforward installation right out of the box.
Dynatron 2U Passive AMD SP5 Cooler
Best for: 2U AMD Genoa Socket SP5 servers
- Socket Compatibility
- Socket SP5
- Material
- Aluminum Fin + Copper embedded Base
- Server Height
- 2U
- Cooling Method
- Passive
- Dimensions
- 118.0 x 92.4 x 64 mm
This heatsink is a passive air cooler designed for 2U server chassis. It supports the AMD Genoa processor family on Socket SP5 and handles heat dissipation up to 320 watts. The unit combines aluminum fins, a copper-embedded base, and integrated heat pipes within a 118.0 by 92.4 by 64 mm profile. It suits you if you operate a rackmount chassis with dedicated system airflow.
Pros
- Dissipates up to 320 watts of CPU power
- Compact 64 mm height fits 2U server enclosures
- Copper-embedded base paired with heat pipes and aluminum fins
- Engineered for AMD Genoa processors on Socket SP5
Cons
- Passive design lacks an integrated cooling fan
- Restricted to AMD Socket SP5 motherboards
Good fit if
- You manage a 2U server enclosure with high-volume chassis fans.
- You deploy an AMD Genoa processor on Socket SP5 with up to 320 watts TDP.
Skip if
- You need an active cooler with an attached fan.
- You use Intel sockets or older AMD server platforms.
Verdict: Dynatron 2U Passive AMD SP5 Server Cooler delivers 320-watt thermal dissipation for AMD Genoa enterprise builds in compact 2U server enclosures. Its fanless structure relies entirely on chassis airflow to keep high-density hardware cool.
Dynatron 2U Socket SP5 Active Cooler
Best for: AMD Genoa Socket SP5 2U servers
- Socket Compatibility
- Socket SP5
- Material
- Aluminum Fin Base and Aluminum Fin Stack
- Server Height
- 2U
- Cooling Method
- Active
- Dimensions
- 118 x 92.4 x 65 mm
This active heatsink fits 2U and larger server chassis, designed specifically for AMD Genoa processors on Socket SP5. You get five heatpipes paired with an aluminum fin base and aluminum fin stack, driven by an attached 4-pin fan. It handles up to 320 watts of CPU heat dissipation within a 118 by 92.4 by 65 millimeter footprint. This unit suits you if you maintain high-density rackmount systems requiring dedicated airflow.
Pros
- Supports up to 320 watts of CPU heat dissipation
- Contains five heatpipes with an aluminum fin stack and base
- Equipped with a 4-pin active cooling fan
- Fits standard 2U and taller server enclosures
Cons
- Compatible only with AMD Socket SP5
- 65 mm height cannot fit 1U rack cases
- Uses an aluminum base rather than copper
Good fit if
- You deploy AMD Genoa processors on Socket SP5.
- You use a 2U or taller server chassis.
- You need heat dissipation for processors rated up to 320 watts.
Skip if
- You build inside a low-profile 1U chassis.
- You use Intel platforms or older AMD SP3 sockets.
- You require a completely passive cooling setup.
Verdict: Dynatron 2U Active SP5 Server Cooler delivers 320-watt heat dissipation for AMD Genoa systems in 2U and larger chassis. Five heatpipes and an integrated 4-pin fan provide active cooling for high-power server setups.
Dynatron 1U LGA 1700 Active Cooler
Best for: 1U Intel LGA1700 rackmount servers
- Socket Compatibility
- Socket LGA1700
- Material
- Copper
- Server Height
- 1U
- Cooling Method
- Active
- Dimensions
- 95 x 94 x 28.2 mm
The Dynatron 1U LGA 1700 Copper Active Cooler is a compact cooling solution built for 1U server chassis. It features a copper vapor chamber with stacked fins and an active 4-pin PWM fan. Measuring 28.2 mm tall, it fits tight rack spaces while supporting Intel Socket LGA1700 processors up to 125 watts. You get targeted thermal dissipation suited for low-profile Alder Lake-S and Raptor Lake rackmount systems.
Pros
- Low 28.2 mm height fits 1U server chassis
- Copper vapor chamber base with stacked fins
- 4-pin PWM active cooling fan
- Handles up to 125 watts of CPU power dissipation
Cons
- Compatible only with Socket LGA1700 motherboards
- Thermal capacity capped at 125 watts
Good fit if
- You need an active cooler under 29 mm for a 1U chassis
- You run an Intel LGA1700 Alder Lake-S or Raptor Lake processor
- You require heat dissipation for a CPU rated up to 125 watts
Skip if
- You use an AMD or non-LGA1700 Intel processor socket
- You run a processor that exceeds 125 watts power dissipation
Verdict: Dynatron 1U LGA 1700 Copper Active Cooler provides targeted 125-watt cooling for slim 1U enclosures. Its low profile and copper vapor chamber suit space-restricted Intel LGA1700 rackmount deployments.
Dynatron 2U LGA 1700 Active Cooler
Best for: 2U server builds with Intel LGA 1700
- Socket Compatibility
- Socket FCLGA 1700
- Server Height
- 2U
- Cooling Method
- Active
- Dimensions
- 106 x 106 x 62 mm
This active cooler fits 2U servers and larger chassis built on Intel Socket LGA 1700. It uses an aluminum radial fin heatsink with an inserted copper core and a 7720 round top-down blowing fan. Measuring 106 by 106 by 62 mm, it dissipates up to 125 watts of CPU power. You will find it suits rackmount builds running 12th Generation Intel Core processors requiring compact top-down airflow cooling.
Pros
- Supports up to 125 watts CPU heat dissipation
- Aluminum radial fins with an inserted copper core
- Compact 62 mm height fits 2U server chassis and up
- Integrated 7720 round fan provides top-down active cooling
Cons
- Limited exclusively to Intel Socket LGA 1700 motherboards
- Maximum heat dissipation rating capped at 125 watts
Good fit if
- You run a 2U or taller server chassis.
- You use an Intel Socket LGA 1700 processor rated up to 125 watts.
Skip if
- You need a compact cooler for a 1U server chassis.
- You use an AMD socket or a non-LGA 1700 Intel motherboard.
- You deploy a CPU that requires more than 125 watts heat dissipation.
Verdict: Dynatron 2U LGA 1700 Active CPU Cooler delivers 125-watt heat dissipation for 2U server chassis using Socket LGA 1700 motherboards. Its copper core and top-down fan keep compact rackmount systems cooled within a 62 mm height profile.
Dynatron 2U SP3 Heatpipe Cooler
Best for: high-TDP AMD EPYC 2U servers
- Socket Compatibility
- Socket SP3
- Material
- Aluminum
- Server Height
- 2U
- Dimensions
- 6 × 6 × 4 inches
- Weight
- 2 pounds
This Dynatron 2U AMD Socket SP3 Cooler is an active server heatsink designed for AMD EPYC and Threadripper processors. It features an aluminum fin heatsink with embedded heatpipes and a 4-pin PWM fan. With thermal capacity rated up to 280 watts TDP, it handles demanding server workloads in standard 2U or taller chassis. You get dedicated cooling if you deploy high-draw AMD enterprise chips in rackmount environments.
Pros
- Supports up to 280 W TDP processors
- Aluminum heatsink with heatpipes
- Includes a 4-pin PWM controlled fan
- Fits standard 2U and larger server chassis
Cons
- Supports only AMD Socket SP3
- Exceeds height limits for 1U server chassis
Good fit if
- You run an AMD EPYC or Threadripper processor on Socket SP3.
- You need up to 280 W TDP cooling in a 2U or taller chassis.
Skip if
- You build in a compact 1U server rack.
- You use an Intel socket or a different AMD socket.
Verdict: Dynatron 2U AMD Socket SP3 Cooler delivers active cooling for high-power EPYC and Threadripper chips up to 280 watts TDP. It fits 2U server enclosures requiring dedicated Socket SP3 support.
Specifications side by side
| Spec | Dynatron Copper LGA1156 Blower Heatsink | Dynatron 1U Active Copper Heatsink | Dynatron 1U Copper Blower Heatsink | Dynatron 1U Passive Vapor Chamber Heatsink | Dynatron 1U Active AM4 Copper Heatsink | Dynatron 1U Passive Copper Heatsink | Dynatron 2U Active Aluminum SP3 Heatsink | Dynatron 1U Copper Vapor Chamber Server Heatsink | Dynatron 1U Copper Vapor Chamber Server Heatsink | Dynatron 2U Active CPU Cooler | Dynatron 2U Passive AMD SP5 Cooler | Dynatron 2U Socket SP5 Active Cooler | Dynatron 1U LGA 1700 Active Cooler | Dynatron 2U LGA 1700 Active Cooler | Dynatron 2U SP3 Heatpipe Cooler |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Socket Compatibility | LGA1156 | LGA1155, LGA1156 | Intel Socket 2011 (Narrow ILM) | Narrow ILM Socket LGA2011 | AMD Socket AM4 | SP3 | Socket SP3 | FCLGA 3647 Narrow ILM | SP3 | not specified | Socket SP5 | Socket SP5 | Socket LGA1700 | Socket FCLGA 1700 | Socket SP3 |
| Material | Copper | Copper | Copper1100 | Copper, Aluminum | Copper | Copper 1100 | Aluminum | Copper with vapor chamber base | Copper 1100 with Skiving Fin | Aluminum Heatsink with Heatpipe | Aluminum Fin + Copper embedded Base | Aluminum Fin Base and Aluminum Fin Stack | Copper | not specified | Aluminum |
| Server Height | not specified | 1U | 1U | 1U | 1U | 1U | 2U | 1U | 1U | 2U | 2U | 2U | 1U | 2U | 2U |
| Cooling Method | not specified | Active | not specified | Passive | Active | Passive | Active | not specified | not specified | Active | Passive | Active | Active | Active | not specified |
| Compatible Device | Intel i5 & i7 CPUs | not specified | not specified | not specified | not specified | AMD EPYC | AMD EPYC | not specified | AMD EPYC | not specified | not specified | not specified | not specified | not specified | not specified |
| Fan Size | 3-inch | not specified | not specified | not specified | not specified | not specified | not specified | not specified | not specified | 60mm | not specified | not specified | not specified | not specified | not specified |
| Dimensions | 3.35 x 3.21 x 1.12 inches | 5 x 5 x 2.5 inches | not specified | 5.2 x 2.4 x 4.5 inches | 5 x 3 x 1 inches | not specified | not specified | 108.0 x 81.0 x 27.0 mm | 120 x 82 x 27 mm | not specified | 118.0 x 92.4 x 64 mm | 118 x 92.4 x 65 mm | 95 x 94 x 28.2 mm | 106 x 106 x 62 mm | not specified |
| Mounting Type | not specified | not specified | Captive Mounting | Captive screw | not specified | not specified | not specified | not specified | not specified | not specified | not specified | not specified | not specified | not specified | not specified |
| System Type | not specified | not specified | not specified | not specified | not specified | not specified | not specified | Server | Server | not specified | not specified | not specified | not specified | not specified | not specified |
| Features | Fan | Fan | not specified | Vapor Chamber | not specified | not specified | not specified | Vapor Chamber | Vapor Chamber | not specified | not specified | not specified | not specified | not specified | not specified |
| Weight | 12.5 ounces | 15.2 ounces | 1.04 pounds | 7.94 ounces | 1.1 pounds | 1.3 pounds | 1 pounds | 1.06 pounds | 1.01 pounds | 1 pounds | not specified | not specified | not specified | not specified | 2 pounds |
| Model | K199 | K199 | R13 | R31 | A18 | A25 | A26 | B4A | A28 | B13 | not specified | J10 | 840556075448 | 840556075455 | T17 |
Comparing the Dynatron Heatsink Lineup
For 1U chassis, Dynatron designs low-profile heatsinks tailored to specific socket compatibility and chassis airflow. Options like the Dynatron Copper LGA1156 Blower Heatsink use integrated blower fans for localized active cooling. If your rack provides directed airflow, passive units like the Dynatron 1U Passive Vapor Chamber Heatsink utilize vapor chambers to dissipate heat across slim server nodes.
For 2U enclosures, Dynatron expands thermal capacity for enterprise platforms. You gain clearance for embedded heatpipes and taller fin arrays. The Dynatron 2U Active Aluminum SP3 Heatsink delivers active cooling for Socket SP3 systems, while the Dynatron 2U Socket SP5 Active Cooler uses five heatpipes and an integrated fan for high-power Socket SP5 server builds.
Who Dynatron Server Coolers Suit Best
Dynatron designs suit specialized 1U and 2U server enclosures. You can select models ranging from 1-inch-tall blocks up to 6-inch-high assemblies. Form factors remain strictly rectangular, utilizing top-down fans, integrated blowers, or passive fin arrays. Zero models offer RGB lighting or aesthetic shrouds.
The catalog covers dense rack spaces, but you will find clear omissions. You will not find full-sized desktop towers, dual-fan heatsinks, or liquid loops. Form factors for 3U or 4U cases are entirely absent across the selection.
When planning your system layout, you can review specifications for the best nvme SSDs with heatsink to evaluate drive clearance alongside CPU cooler dimensions.
How to Choose a Dynatron Heatsink
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Match Processor Socket Types
Server sockets vary widely. You must confirm socket support before buying. Dynatron lists specific sockets like Intel LGA 1700, LGA 2011 Narrow ILM, LGA 1156, and AMD SP3 or SP5. For example, the Dynatron 1U Active AM4 Copper Heatsink mounts specifically to AMD AM4 motherboards. Sockets require exact mounting hole layouts and bracket spacing. Check your motherboard specification sheet to identify your exact socket type.
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Verify Enclosure Rack Units
Chassis height dictates physical cooler limits. You need to check the server rack unit specification before picking a model. A 1U chassis requires heatsinks measuring around 1 inch to 1.12 inches tall. A 2U chassis accommodates taller coolers, such as the Dynatron 2U Active Aluminum SP3 Heatsink at 6 inches tall. Measuring vertical clearance from the CPU socket to your chassis lid prevents clearance failures during assembly.
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Select Active or Passive Cooling
Cooling method depends on your chassis fan configuration. Passive heatsinks feature fin arrays with no mounted fans, requiring high CFM chassis fans and dedicated air ducts to move air across the block. Active heatsinks incorporate integrated top-down fans or alloy blowers to generate dedicated airflow directly over the fins. Choose active coolers like the Dynatron 2U Socket SP5 Active Cooler if your case lacks targeted internal server fan ducts.
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Evaluate Copper Versus Aluminum
Heatsink materials affect thermal transfer and total rack weight. Copper provides higher thermal conductivity for concentrated heat loads, though it increases mass. Pure copper models often weigh over one pound. Aluminum designs offer lighter overall weight for multi-node deployments. If total rack weight is a critical factor, check product weight specifications. The Dynatron 1U Passive Vapor Chamber Heatsink uses aluminum fins with a copper vapor chamber, weighing 7.94 ounces.
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Review Internal Thermal Components
High-wattage processors require efficient heat spreading across tight surface areas. Look at internal components like vapor chambers and embedded heatpipes. Vapor chambers spread heat uniformly across thin bases in compact 1U units. Embedded heatpipes route thermal energy directly into the fin stack. For high-output hardware, check the rated TDP dissipation. For example, the Dynatron 2U Passive AMD SP5 Cooler specifies 320-watt dissipation to handle heavy server workloads without an attached fan.
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Check Thermal Interface Application
Server installations benefit from ready-to-mount thermal compound. Some models arrive with pre-printed thermal paste on the contact base to streamline deployment across server racks. The Dynatron 2U Active CPU Cooler features pre-printed Shin-Etsu 7762 compound directly out of the box. If a heatsink omits pre-applied paste, you must supply compatible thermal grease separately. Verifying thermal interface inclusion in the product specifications saves setup time during initial server assembly.
Frequently asked questions
How much TDP can a Dynatron SP5 cooler handle?
Dynatron Socket SP5 coolers handle up to 320 watts of thermal design power for AMD Genoa enterprise processors. Both the active J10 model and the passive 2U version are rated for 320-watt dissipation. If you run a fanless setup, you must ensure your 2U rack enclosure supplies sufficient forced airflow across the heatsink fins.
Which Dynatron coolers come with pre-applied thermal paste?
The Dynatron B13 2U active server CPU cooler includes pre-printed Shin-Etsu 7762 thermal compound directly out of the box. This built-in thermal interface material speeds up your installation by removing the need to apply paste manually. The B13 cooler also integrates a 60mm cooling fan and embedded heatpipes within its compact 2.6-inch-high frame.
Can you use passive Dynatron heatsinks without chassis fans?
You cannot run passive Dynatron heatsinks safely without external chassis fans. Passive units like the 1U copper A25 and the 165W R31 lack attached blowers and rely completely on directed airflow moving through your server rack. Without high-speed system fans pushing air across their aluminum or copper fins, heat builds up rapidly and can cause hardware throttling.
What is the height difference between 1U and 2U Dynatron heatsinks?
Dynatron 1U heatsinks maintain low profiles between 1.0 and 1.12 inches tall, while 2U models typically measure between 2.44 and 4 inches high. For instance, the 1U A18 cooler stands just 1 inch tall to clear 1U rack lids. By contrast, the 2U LGA 1700 active cooler reaches 2.44 inches, providing extra vertical room for larger fins.
Does Dynatron make active coolers for AMD AM4 rackmount servers?
Yes, Dynatron offers the A18 active copper cooler designed specifically for 1U AMD Socket AM4 builds. This model uses an integrated blower fan and pure copper construction to exhaust heat horizontally within dense server setups. Its compact 1-inch height and 3-by-5-inch footprint ensure direct clearance in standard 1U rack environments running AM4 processors.
What cooling method does the Dynatron LGA 1700 1U cooler use?
The Dynatron 1U LGA 1700 active cooler combines a copper vapor chamber with an integrated cooling fan. It provides active heat dissipation rated for up to 125 watts in slim rackmount enclosures. Standing at just 1.11 inches tall, the unit uses its vapor chamber base to spread processor heat rapidly across its compact frame.
Which Dynatron heatsink supports Intel Socket LGA 2011 Narrow ILM?
Dynatron provides both active and passive options for LGA 2011 Narrow ILM sockets, including the R13 and R31 models. The R13 is an active cooler featuring Copper1100 skived fins and an alloy blower for sub-95W CPUs. The passive R31 pairs a copper vapor chamber with aluminum fins to dissipate up to 165 watts TDP.