MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack vs MECCANIXITY 20mm x 20mm x (2026): Key Differences
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You are comparing the meccanixity copper heatsink 6x6x4mm self vs heatsink copper pad shim. Both items use copper to help cool small electronic components like IC chipsets. The main difference lies in their shape and mounting method. One is a small finned block with built-in adhesive, while the other is a flat, thin shim that requires separate adhesive. You need to choose based on the space available and the specific component you are trying to cool.
Key differences
| Aspect | MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack | MECCANIXITY 20mm x 20mm x 1.5mm Copper Shims |
|---|---|---|
| Dimensions | 6x6x4mm | 20mm x 20mm x 1.5mm |
| Mounting Type | Self Adhesive | Adhesive not included |
| Compatible Device | Chip, IC chipset | Chips, notebooks, memory modules |
Which one should you choose?
Choose MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack if
- You need a ready-to-use solution with pre-applied adhesive.
- You are cooling a small IC chipset where space is very limited.
- You want a finned structure to increase surface area for heat dissipation.
Choose MECCANIXITY 20mm x 20mm x 1.5mm Copper Shims if
- You need a larger surface area to spread heat across a component.
- You are cooling memory modules or notebook chips that require a flat profile.
- You prefer to control the adhesive type or use your own thermal tape.
Verdict: Choose the 6x6x4mm heatsink if you need a compact, finned block with built-in adhesive for direct IC cooling. Select the 20mm copper shim if you require a larger, flat surface area for memory modules or notebook components. Your choice depends on the specific size and shape of the component you are cooling.
Size and Mounting Comparison
Physical Dimensions
Product A measures 6x6x4mm, which translates to 0.24x0.24x0.16 inches. This small block fits tight spaces on small IC chips. Product B is larger at 20x20x1.5mm, or 0.79x0.79x0.06 inches. It covers a wider area but sits much flatter. You choose based on the surface area you need to cover. The smaller heatsink is for precise spots. The larger shim is for broader chip surfaces.
Mounting Method
Product A comes with ordinary self-adhesive backing already attached. You peel off the protective film and stick it directly to the component. Product B does not include adhesive. You must use your own adhesive to attach it to hardware. This means Product A is ready to install immediately. Product B requires you to source separate mounting materials. The built-in adhesive saves you a step during installation.
Compatible Devices
Product A targets chips and IC chipsets specifically. It is designed to improve heat dissipation for these small components. Product B lists chips, notebooks, memory modules, and north and south bridges. It also mentions graphic cards and other small electronic devices without cooling. Product B has a broader list of compatible devices. It is suitable for more varied electronic applications beyond just simple ICs.
Thickness Profile
Product A has a height of 4mm or 0.16 inches. This adds some vertical space above the component. Product B is only 1.5mm thick, or 0.06 inches. It creates a very low profile. If you have limited clearance above the chip, the thinner shim is better. The thicker heatsink provides more fin surface area but requires more vertical room. Your case or motherboard layout will dictate which height works best.
Material Quality
Both products are made of copper. Copper is known for high thermal conductivity. Product A uses copper to improve heat dissipation efficiency. Product B uses copper to transfer heat from ICs and graphic cards. Both rely on the same base material for cooling performance. There is no difference in the core material. You get the thermal benefits of copper in either option. The difference is in how that copper is shaped.
Heat Resistance
Product B specifies that the copper gaskets can withstand high temperatures of 160 degrees. This durability claim helps you know the limits of the shim. Product A does not list a specific maximum temperature rating in the provided data. It mentions stable operation but gives no degree value. If you are working with components that get very hot, the specified limit of Product B is useful information. Product A lacks this specific data point.
Which heatsink fits your chip
For small IC chipset cooling needs
This pack includes five small copper blocks measuring 6x6x4mm. The 4mm height provides vertical surface area for heat dissipation. The self-adhesive backing simplifies installation on tight spaces. You get multiple units for various small components. This compact size ensures the heatsink fits where larger options cannot.
For wide surface area thermal transfer
These copper shims measure 20x20mm with a 1.5mm thickness. The larger footprint covers more area on chips or memory modules. The flat design suits components requiring broad contact. You receive six pieces for broader coverage. The copper material effectively transfers heat from the source to the shim surface.
For multiple small component upgrades
You receive five distinct heatsinks in this package. Each block is 6x6mm with a 4mm fin height. The self-adhesive nature allows quick placement on various ICs. This option is ideal when you need to cool several small chips simultaneously. The consistent size ensures uniform cooling across multiple components.
The products compared
MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack
Best for: cooling small IC chipsets in tight spaces
- Material
- Copper
- Compatible Device
- chip, IC chipset
- Dimensions
- 6x6x4mm
- Mounting Type
- Self Adhesive
View on Amazon: MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack Affiliate link
This pack of five copper heatsinks measures 6x6x4mm. The solid copper material improves heat dissipation for small components like IC chipsets. Each unit includes self-adhesive backing for easy installation on chips. The compact size fits tight spaces where larger coolers cannot go. You get multiple units for covering several components at once. This is a practical solution for targeted cooling on small electronic parts.
Pros
- Solid copper construction for efficient heat transfer
- Includes five units for multiple components
- Self-adhesive backing simplifies installation
- Compact 6x6x4mm size fits tight spaces
Cons
- Very small surface area limits cooling power
- Only suitable for low-heat IC chipsets
- Adhesive may not hold on uneven surfaces
Good fit if
- You need to cool small IC chipsets
- You have limited space around components
- You want to cool multiple small chips
Skip if
- You need to cool a main CPU
- You require high airflow cooling
- You have large heat-generating components
Verdict: MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack is a targeted solution for cooling small IC chipsets in tight spaces. It suits builders who need to manage heat on multiple small components rather than a single large processor.
MECCANIXITY 20mm x 20mm x 1.5mm Copper Shims
Best for: cooling small IC chips and memory modules
- Material
- Copper
- Compatible Device
- Chips, notebooks, memory modules
- Dimensions
- 20mm x 20mm x 1.5mm
View on Amazon: MECCANIXITY 20mm x 20mm x 1.5mm Copper Shims Affiliate link
This MECCANIXITY heatsink is a 20mm x 20mm copper pad with a 1.5mm thickness. It targets small electronic components like ICs, memory modules, and notebook chips. The copper material transfers heat away from these areas. You must apply your own adhesive to attach it. The surface may darken over time, but this does not reduce cooling performance. You can sand it if needed.
Pros
- Solid copper construction for effective heat transfer
- 20mm x 20mm size fits many small chips
- 1.5mm thickness provides substantial thermal mass
- Withstands temperatures up to 160 degrees
Cons
- Requires separate adhesive for installation
- Surface darkens when exposed to air
- Only covers a single small component
Good fit if
- You need to cool specific IC chips
- You are working on notebook motherboards
- You want to protect memory modules from heat
Skip if
- You need a pre-glued solution
- You are cooling a large CPU socket
- You require a pre-assembled unit
Verdict: MECCANIXITY 20mm Copper Shim 1.5mm is a simple copper pad for cooling small chips. It fits users who need targeted heat dissipation for ICs or memory modules on a budget.
Specifications side by side
| Spec | MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack | MECCANIXITY 20mm x 20mm x 1.5mm Copper Shims |
|---|---|---|
| Material | Copper | Copper |
| Compatible Device | chip, IC chipset | Chips, notebooks, memory modules |
| Dimensions | 6x6x4mm | 20mm x 20mm x 1.5mm |
| Mounting Type | Self Adhesive | not stated |
| Size | 6x6x4mm | 20mm x 20mm x 1.5mm |
| Model | mea220402ee0154 | mea231224ee000534 |
Frequently asked questions
Can the 6x6x4mm heatsink replace a large CPU cooler?
No. These small copper blocks are designed for cooling tiny IC chipsets in tight spaces. They lack the surface area and mass required to dissipate heat from a main processor. You should use them for secondary components like VRMs or chipset bridges, not for primary CPU thermal management.
Are these heatsinks made of pure copper?
Yes. Both the 6x6x4mm blocks and the 20mm x 20mm shims are constructed entirely from copper. Copper offers high thermal conductivity, allowing it to draw heat away from components quickly. This material choice ensures effective passive cooling for small electronic parts without needing active fans.
Which option is better for memory modules?
The 20mm x 20mm x 1.5mm copper shim is better. Its larger footprint covers more surface area, which is ideal for standard memory modules. The 6x6x4mm block is too small to make contact with most RAM sticks. You want the wider pad to maximize heat transfer from the memory chips.
How thick is the copper shim?
The shim is 1.5mm thick, which equals 0.06 inches. This low profile allows it to sit flat against components without interfering with nearby parts. The 6x6x4mm heatsink is taller at 4mm, providing more vertical surface area but requiring more clearance space around the component.
Do I need thermal paste for these?
You typically do not need additional thermal paste. Both products feature self-adhesive backing for direct application. The adhesive layer ensures proper contact between the copper and the heat source. Simply peel and stick them onto the target component for immediate passive cooling performance.
What is the difference in surface area?
The 20mm shim offers a much larger contact area than the 6mm block. The shim covers 400 square millimeters, while the block covers only 36 square millimeters. You choose the shim for broader heat spreading and the block for targeted cooling on very small, specific chips.