MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack or MECCANIXITY 20x20mm 2mm Copper Shims? Which MECCANIXITY Model to Buy
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This guide compares the meccanixity 6x6x4mm copper heatsink 5 pack vs 20x20mm 2mm copper shims. Both items use copper for heat dissipation and include adhesive backing for easy installation on small electronic components. The main difference lies in their physical dimensions and intended application scope. One model offers a compact footprint for integrated circuits, while the other provides a larger surface area for broader thermal management tasks.
Key differences
| Aspect | MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack | MECCANIXITY 20x20mm 2mm Copper Shims |
|---|---|---|
| Dimensions | 6x6x4mm | 20x20x2mm |
| Compatible Device | chip, IC chipset | Desktop computer GPU, CPU |
| Mounting Type | Self Adhesive | Thermal conductive adhesive tape |
Which one should you choose?
Choose MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack if
- You need to cool small IC chips or chipset components with limited space.
- You require a thicker profile of 4mm for localized heat spreading.
Choose MECCANIXITY 20x20mm 2mm Copper Shims if
- You need to cool larger surfaces like desktop GPU or CPU components.
- You prefer a larger 20x20mm footprint for broader heat distribution.
Verdict: Choose the 6x6x4mm heatsink if your target is a small, specific chip where space is tight. Opt for the 20x20mm shims if you need to cover a larger area on a GPU or CPU. Both use copper and adhesive, so your choice depends on the size of the component you are cooling.
Small Copper Heatsink Comparison
compatible device
Product A targets general chip and IC chipset cooling, offering a versatile solution for various small electronic components. Product B explicitly lists desktop computer GPU and CPU compatibility, alongside notebook bridges and memory modules. This broader specification suggests Product B is designed for higher-traffic areas like graphics cards or main processors. You should choose Product A for general component cooling. Select Product B if you need dedicated cooling for major system components like GPUs or CPUs. The explicit mention of major hardware gives Product B a clearer use case for high-heat areas.
dimensions
Product A measures 6x6x4mm, providing a compact footprint with a 4mm height. Product B is significantly larger at 20x20mm with a 2mm thickness. The larger surface area of Product B allows for greater heat dissipation capacity due to more exposed copper. Product A’s smaller size makes it suitable for tight spaces where Product B would not fit. You must measure your target component carefully. If space is limited, Product A fits. For maximum heat spreading on a flat surface, Product B’s larger area is superior. The size difference dictates where each can be installed.
material
Both products are constructed entirely from copper. This material choice ensures high thermal conductivity for efficient heat transfer away from the source. Copper is known for its durability and ability to withstand high temperatures, as noted in Product B’s description. Since both use the same base material, the core thermal property is identical. The difference lies in the shape and surface area rather than the substance itself. You get the benefits of copper in either case. There is no advantage in material quality between the two options.
mounting
Product A uses ordinary self-adhesive backing for installation. Product B includes thermal conductive adhesive tape. Thermal conductive adhesive is designed to fill microscopic gaps between the heatsink and the component, improving heat transfer efficiency compared to standard adhesive. This means Product B likely offers better thermal performance upon installation due to the adhesive type. You should consider the adhesive quality when deciding. Standard adhesive works for simple attachment. Thermal conductive tape enhances the cooling connection. This gives Product B a functional advantage in installation effectiveness.
build
Product A is a solid block with fins designed to increase surface area for a small footprint. Product B is a flat shim or gasket. The finned design of Product A helps dissipate heat into the surrounding air more effectively than a flat sheet. Product B relies on spreading heat across a larger area to a chassis or heatsink. You need to consider how the heat will be removed. If you need active air cooling from the fins, Product A is better. If you are spreading heat to a larger metal surface, Product B works. The finned structure provides a practical advantage for air dissipation.
Choose the right MECCANIXITY copper heatsink
Need small heatsinks for IC chips
Product A measures 6x6x4mm, making it ideal for tight spaces on small components like chipset coolers. The 4mm height provides adequate surface area for heat dissipation without overwhelming the board. You get five units, allowing you to cool multiple small chips simultaneously with self-adhesive backing for simple installation.
Cooling desktop GPU or CPU
Product B is explicitly designed for desktop computer GPUs and CPUs. Its larger 20x20mm footprint covers more surface area for better heat transfer on larger components. The 2mm thickness offers a sturdy base for thermal conduction. This makes it a better fit for high-heat desktop hardware compared to smaller chip heatsinks.
Cooling notebook bridges or memory
Product B lists compatibility with notebook north and south bridges and memory modules. The 20x20mm size ensures coverage for these specific areas. The thermal conductive adhesive tape provides a secure bond. This model is better suited for these specific laptop components than the smaller 6x6mm heatsink option.
The products compared
MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack
Best for: cooling multiple small IC chips
- Material
- Copper
- Compatible Device
- chip, IC chipset
- Dimensions
- 6x6x4mm
- Mounting Type
- Self Adhesive
View on Amazon: MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack Affiliate link
You get five small copper heatsinks measuring 6x6x4mm. The self-adhesive backing makes installation straightforward for IC chipsets. Copper material improves heat dissipation efficiency. This pack suits you if you need to cool multiple small components on a motherboard or electronic device. The compact size fits tight spaces where larger coolers cannot go.
Pros
- Copper construction for efficient heat dissipation
- 6x6x4mm dimensions fit small IC chipsets
- Includes self-adhesive backing for easy mounting
- Pack of 5 heatsinks for multiple components
Cons
- Small surface area limits cooling for high heat output
- Standard adhesive may lack long-term thermal stability
- No included thermal paste or mounting hardware
Good fit if
- You need to cool multiple small IC chips
- You require compact heatsinks for tight spaces
- You want a copper material for better conductivity
Skip if
- You need to cool a high-TDP CPU
- You prefer screw-mounted heatsinks for security
- You need large surface area for airflow
Verdict: MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack is a practical solution for cooling small IC components. It fits you if you need multiple small copper heatsinks with adhesive backing for a motherboard or electronics project.
MECCANIXITY 20x20mm 2mm Copper Shims
Best for: Cooling small ICs and memory modules
- Material
- Copper
- Compatible Device
- Desktop computer GPU, CPU
- Dimensions
- 20mm x 20mm x 2mm
- Mounting Type
- Thermal conductive adhesive tape
- Weight
- 1.41 ounces
View on Amazon: MECCANIXITY 20x20mm 2mm Copper Shims Affiliate link
This MECCANIXITY copper shim measures 20 by 20 millimeters with a 2 millimeter thickness. It features a thermal conductive adhesive backing for direct attachment to chips. The solid copper construction helps transfer heat from components like GPUs or northbridge chips. You should use this if you need a durable, thick copper pad for small electronic devices. It withstands temperatures up to 160 degrees Celsius. The surface may darken over time, but cooling performance remains unaffected.
Pros
- 20mm by 20mm by 2mm solid copper construction
- Thermal conductive adhesive tape for easy installation
- Withstands high temperatures up to 160 degrees Celsius
- Suitable for cooling ICs, GPUs, and memory modules
Cons
- Limited to small chip cooling applications
- Surface darkens when exposed to air
- Adhesive backing may not suit all mounting surfaces
Good fit if
- You need to cool small ICs or memory modules
- You require a thick copper shim for heat transfer
- You want a simple adhesive-backed solution for GPUs
Skip if
- You need large heatsinks for main CPU cooling
- You prefer fan-based active cooling solutions
- You require mounting hardware other than adhesive
Verdict: MECCANIXITY 20mm Copper Shim 2mm Thick is a practical solution for cooling small electronic components like GPUs or memory modules. It fits users who need a simple, adhesive-backed copper pad for targeted heat dissipation on desktop hardware.
Specifications side by side
| Spec | MECCANIXITY 6x6x4mm Copper Heatsink 5-Pack | MECCANIXITY 20x20mm 2mm Copper Shims |
|---|---|---|
| Material | Copper | Copper |
| Compatible Device | chip, IC chipset | Desktop computer GPU, CPU |
| Dimensions | 6x6x4mm | 20mm x 20mm x 2mm |
| Mounting Type | Self Adhesive | Thermal conductive adhesive tape |
| System Type | not stated | Desktop |
| Weight | not stated | 1.41 ounces |
| Size | 6x6x4mm | 2mm |
| Model | mea220402ee0154 | mea231220ee000014 |
Frequently asked questions
Which heatsink is better for cooling memory modules?
The 20x20mm copper shim is the better choice for memory modules. Its 20mm width provides a larger surface area to contact the heat-generating chips on RAM sticks. The 6x6mm heatsink is too small to effectively cover the entire module, making the larger shim more practical for this specific application.
Can I use the 6x6mm heatsink on a GPU?
You can use the 6x6mm heatsink on a GPU, but it is limited to very small components. The 20x20mm shim is explicitly listed as compatible with GPUs, offering a more robust solution for larger graphics card chips. The smaller heatsink is better suited for tiny integrated circuits rather than major GPU components.
What is the thickness difference between these two products?
The 6x6mm heatsink has a height of 4mm, while the 20x20mm shim is 2mm thick. This means the smaller heatsink is twice as tall. The taller profile may provide slightly more surface area for heat dissipation, whereas the thinner shim is designed for tight spaces where height is restricted.
Are both products made of copper?
Yes, both products are made entirely of copper. Copper is chosen for its excellent thermal conductivity, allowing it to draw heat away from components quickly. This shared material ensures both the small heatsink and the larger shim perform well at transferring heat from electronic chips to the surrounding air.
How many heatsinks do I get in the 6x6mm pack?
The 6x6mm product comes in a 5-pack, giving you five individual units. This is useful when you need to cool multiple small chips across a motherboard or electronics project. The 20x20mm shim is sold individually, so you would need to buy multiple units to achieve the same quantity.
Is the 20x20mm shim suitable for desktop computers?
Yes, the 20x20mm shim is explicitly listed as compatible with desktop systems. It is designed for cooling small electronic components like GPUs, memory modules, and bridges within a desktop environment. The adhesive backing allows for easy installation on these internal components to improve heat dissipation without complex mounting hardware.
Which product has adhesive backing?
Both products include adhesive backing for easy installation. This feature allows you to stick them directly onto heat-generating components without needing additional thermal pads or clips. The adhesive ensures a secure connection for effective heat transfer, making both the 6x6mm heatsink and the 20x20mm shim simple to apply.
What are the dimensions of the 20x20mm shim?
The 20x20mm shim measures 0.79 inches in width and length, with a thickness of 0.08 inches. These dimensions make it square and relatively thin. The larger surface area compared to the 6x6mm heatsink allows it to cover more of a component, which is ideal for cooling broader heat sources.