Dynatron 2U Active Server CPU Cooler vs Dynatron 1U Server LGA 2011 CPU Cooler: Spec Comparison
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This dynatron k555 2u active cooler vs r16 1u server CPU comparison highlights two distinct cooling solutions for enterprise environments. Both units are active air coolers designed for server racks and utilize copper for heat transfer. The primary difference lies in their physical profile and socket support. The K555 offers a taller 2U design for LGA 115X and 1200 processors. The R16 is a compact 1U unit built specifically for LGA 2011 sockets. You must match the cooler to your motherboard socket and chassis height.
Key differences
| Aspect | Dynatron 2U Active Server CPU Cooler | Dynatron 1U Server LGA 2011 CPU Cooler |
|---|---|---|
| Socket Compatibility | LGA 115X, LGA 1200 | LGA 2011 |
| Server Height | 2U | 1U |
| Cooling Technology | Copper base with aluminum fins and heat pipes | Vapor chamber base with copper stacked fins |
| TDP Rating | not listed | 150 Watts |
| Pre-applied Thermal Compound | not listed | Shin-Etsu G751 |
Which one should you choose?
Choose Dynatron 2U Active Server CPU Cooler if
- You need a cooler for LGA 115X or LGA 1200 sockets
- Your server chassis supports 2U height constraints
- You prefer a traditional heat pipe and fin array design
Choose Dynatron 1U Server LGA 2011 CPU Cooler if
- Your system uses LGA 2011 square type sockets
- You require a low-profile 1U cooler for dense racks
- You want pre-applied Shin-Etsu G751 thermal compound
Verdict: Select the K555 if your platform uses LGA 115X or LGA 1200 sockets and you have space for a 2U tower. Choose the R16 for LGA 2011 systems where a 1U footprint is mandatory and the processor TDP is around 150 Watts. Each unit is specialized for its specific socket and height requirements.
Server Cooler Specs Compared
Socket Compatibility
The Dynatron K555 supports LGA 115X and LGA 1200 sockets. This makes it suitable for modern consumer and workstation platforms that use these Intel interfaces. The Dynatron R16 is designed specifically for LGA 2011. It targets Sandy Bridge EP and EX processors. This square type socket has an 80 by 80mm mounting pitch. You must choose the cooler that matches your motherboard socket. The K555 covers newer platforms while the R16 is for older server chips. They do not share compatible sockets.
Server Height
Physical space in a server rack determines which cooler you can install. The K555 is a 2U active cooler. It requires two rack unit slots of vertical clearance. The R16 is a 1U server CPU fan. It fits into half the vertical space of the K555. If your chassis is tight, the 1U profile of the R16 is essential. The 2U design of the K555 allows for a larger heatsink but limits installation options. You need to check your server height limits before buying either unit.
Cooling Material
Heat transfer efficiency depends on the base material. The K555 uses a copper base with aluminum fins. It also includes aluminum heat pipes embedded in the design. The R16 features a vapor chamber base with copper stacked fins. A vapor chamber can spread heat faster across the base area than traditional heat pipes. Both units use copper for primary heat transfer. The R16 uses a vapor chamber which may offer better thermal distribution. The K555 relies on standard heat pipe technology.
Dimensions
Size affects airflow and fit. The K555 measures 94.0 by 87.5 by 67.7mm. The R16 measures 5.4 by 4.7 by 2.1 inches. The R16 is significantly smaller in overall volume. This compact size helps it fit in dense server blades. The K555 has a larger surface area for heat dissipation. Larger fins can move more air if the fans are adequate. You should measure your available space carefully. The smaller R16 is easier to fit in constrained 1U servers.
Thermal Paste
Pre-applied thermal compound saves time during installation. The R16 comes with pre-printed Shin-Etsu G751 thermal compound. This ensures immediate contact between the cooler and the CPU. The K555 data does not list pre-applied thermal paste. You may need to apply your own paste for the K555. This adds a step to the setup process. The R16 includes the paste for convenience. This is a practical advantage for quick swaps or installations.
TDP Rating
Power handling capability is critical for server stability. The R16 has a stated TDP rating of 150 watts. It supports CPUs with power draw up to that limit. The K555 data does not list a specific TDP rating. Without this number, you cannot verify if it handles high-power chips. The R16 provides clear guidance on its thermal limits. You should rely on the R16 if you know the CPU wattage. The K555 lacks this specific specification in the provided data.
Choose the Right Dynatron Cooler
Users with LGA 115X or 1200 sockets
The Dynatron K555 supports LGA 115X and LGA 1200 sockets. This broad compatibility suits modern workstations and consumer platforms. It features a copper base with aluminum fins and heat pipes. The design fits 2U server racks and larger chassis. You get reliable active cooling for these specific Intel interfaces without needing adapter hardware.
Owners of LGA 2011 Sandy Bridge EP systems
The Dynatron R16 targets LGA 2011 sockets for Sandy Bridge EP processors. It handles up to 150 watts of TDP. The vapor chamber base with copper stacked fins aids heat dissipation. Pre-applied Shin-Etsu G751 thermal compound simplifies installation. This 1U profile is ideal for dense server racks requiring specific socket support and high thermal efficiency.
Admins needing compact 1U server cooling
Space is limited in 1U server chassis. The Dynatron R16 measures 2.1 inches wide, fitting tight environments. It supports 150 watts TDP, ensuring adequate cooling for powerful CPUs. The vapor chamber design spreads heat quickly across the copper fins. This compact, active solution maintains system stability in confined rack spaces where larger coolers cannot fit.
The products compared
Dynatron 2U Active Server CPU Cooler
Best for: 2U Intel LGA 115X/1200 server builds
- Socket Compatibility
- LGA 115X, LGA 1200
- Server Height
- 2U
- Cooling Method
- Active
- Material
- Copper, Aluminum
- Dimensions
- 6 × 6 × 6 inches
View on Amazon: Dynatron 2U Active Server CPU Cooler Affiliate link
This is a Dynatron K555 active cooler designed for 2U server chassis and up. It supports LGA 115X and LGA 1200 sockets. The unit uses a copper base with aluminum fins and embedded heat pipes. Dimensions are 94.0 x 87.5 x 67.7mm. It relies on a dual ball bearing for longevity. You need this for compatible Intel server platforms in standard 2U enclosures.
Pros
- Supports LGA 115X and LGA 1200 sockets
- Fits 2U server chassis and taller
- Copper base with aluminum fins and heat pipes
- Dual ball bearing construction
Cons
- Limited to 2U height compatibility
- No mention of fan speed control
- Specific to Intel LGA sockets only
Good fit if
- You are building a 2U server system
- You use an LGA 115X or LGA 1200 CPU
- You need a reliable ball bearing cooler
Skip if
- You have a 1U server chassis
- You use AMD or non-LGA sockets
- You need silent operation without fans
Verdict: Dynatron K555 2U Active Server Cooler is a solid choice for LGA 115X and LGA 1200 builds in 2U frames. It offers durable ball bearing support for standard server heights.
Dynatron 1U Server LGA 2011 CPU Cooler
Best for: 1U server builds with LGA2011 sockets
- Socket Compatibility
- LGA2011
- TDP Rating
- 150 Watts
- System Type
- Server
- Server Height
- 1U
- Features
- Fan
- Dimensions
- 5.4 × 2.1 × 4.7 inches
View on Amazon: Dynatron 1U Server LGA 2011 CPU Cooler Affiliate link
The Dynatron R16 is a 1U server CPU cooler designed for Intel LGA2011 sockets. It supports up to 150W TDP processors using a vapor chamber base and copper stacked fins. The unit measures 5.4 inches in length and weighs 13.8 ounces. It includes pre-printed Shin-Etsu G751 thermal compound. This cooler suits users needing a low-profile solution for Sandy Bridge EP or EX processors in tight server chassis.
Pros
- Supports CPU power up to 150 Watts
- Uses vapor chamber base with copper stacked fins
- Includes pre-printed Shin-Etsu G751 thermal compound
- Specifically designed for LGA2011 square socket
Cons
- Limited to LGA2011 socket compatibility
- Only supports Intel Sandy Bridge EP/EX processors
- 1U height restricts use in standard desktop cases
Good fit if
- You are building a 1U server chassis
- You use an Intel LGA2011 Sandy Bridge processor
- You need a compact cooler for a 150W TDP CPU
Skip if
- You use a different CPU socket type
- You need a cooler for a standard desktop PC
- You require support for newer Intel socket generations
Verdict: Dynatron R16 1U Server Cooler fits users who need a specialized 1U solution for LGA2011 Sandy Bridge processors. It provides adequate cooling for 150W TDP chips in space-constrained server environments.
Specifications side by side
| Spec | Dynatron 2U Active Server CPU Cooler | Dynatron 1U Server LGA 2011 CPU Cooler |
|---|---|---|
| Socket Compatibility | LGA 115X, LGA 1200 | LGA2011 |
| TDP Rating | not stated | 150 Watts |
| System Type | not stated | Server |
| Server Height | 2U | 1U |
| Cooling Method | Active | not stated |
| Material | Copper, Aluminum | not stated |
| Features | not stated | Fan |
| Dimensions | 6 × 6 × 6 inches | 5.4 × 2.1 × 4.7 inches |
| Weight | not stated | 13.8 ounces |
| Model | K555 | R16 |
Frequently asked questions
Does the Dynatron K555 fit in a 1U server chassis?
No, the Dynatron K555 is designed specifically for 2U server frames. Its physical dimensions are six inches in width, height, and length. This profile exceeds the standard 1U height limit of 1.7 inches. You must verify your chassis supports 2U height before installation to ensure proper clearance and airflow.
Is the Dynatron R16 compatible with LGA 1700 sockets?
No, the Dynatron R16 is built exclusively for LGA 2011 sockets. It targets Sandy Bridge EP processors and does not support newer interfaces like LGA 1700. If you are using a modern Intel platform, this cooler will not mount correctly. You should look for a model supporting your specific socket type.
What cooling method do both Dynatron coolers use?
Both the Dynatron K555 and R16 utilize active cooling methods. This means they rely on fans to move air across the heatsink fins. The R16 explicitly lists a fan as a feature. Active cooling is standard for server environments where consistent thermal performance is required under load.
How much does the Dynatron R16 weigh?
The Dynatron R16 weighs 13.8 ounces. This weight reflects the mass of its copper and aluminum construction. It is lighter than many larger 2U coolers due to its compact 1U profile. Ensure your server motherboard can support this mass without strain on the socket retention mechanism.
Can the Dynatron K555 cool a 150W TDP processor?
The provided data does not specify the thermal design power (TDP) rating for the Dynatron K555. It notes suitability for LGA 115X and 1200 builds. For comparison, the R16 is noted as adequate for 150W TDP chips. You should consult the manufacturer specifications for the K555 to confirm its thermal limits.
What materials are used in the Dynatron K555 heatsink?
The Dynatron K555 uses copper and aluminum for its construction. Copper typically provides efficient heat absorption from the CPU, while aluminum fins help dissipate that heat into the airflow. This combination is common in server-grade air coolers for balancing thermal performance and weight.
Which cooler is better for LGA 2011 builds?
The Dynatron R16 is the appropriate choice for LGA 2011 builds. It is explicitly designed for this socket and Sandy Bridge EP processors. The K555 supports LGA 115X and 1200 sockets but lacks compatibility with LGA 2011. Select the R16 to ensure proper mounting and cooling for your specific platform.