Awxlumv 40mm Anodized Aluminum Heatsink vs Awxlumv 50x50x20mm Aluminum Heatsink 4-Pack (2026): Key Differences
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You are comparing the awxlumv 4pcs anodized aluminium heat vs 4pcs 50mm aluminum heatsink for passive cooling needs. Both kits include four anodized aluminum heatsinks with a twenty-millimeter height. They share a passive cooling method suitable for IC chips and stepper motors. The main difference lies in their footprint and material grade. The forty-millimeter model offers a compact solution, while the fifty-millimeter version provides a larger surface area and a specified 6063-T5 aluminum alloy for potentially better thermal performance.
Key differences
| Aspect | Awxlumv 40mm Anodized Aluminum Heatsink 4-Pack | Awxlumv 50x50x20mm Aluminum Heatsink 4-Pack |
|---|---|---|
| Dimensions | 40 x 40 x 20mm | 50 x 50 x 20mm |
| Weight | 1.45 oz per unit | 15 oz per unit |
| Material Grade | Anodized aluminum | 6063-T5 aluminum anodized |
| Compatible Devices | IC chip, NEMA17, TEC1-12706 | GPU, CPU, LED Chipset, Router, MOSFET |
| Fin Count | not listed | 14 fins |
Which one should you choose?
Choose Awxlumv 40mm Anodized Aluminum Heatsink 4-Pack if
- You need a compact heatsink for tight spaces like small VRM areas or limited PC cases.
- You are cooling lower-power components such as basic IC chips or small regulators.
- You prefer a lighter unit that is easier to handle during installation.
Choose Awxlumv 50x50x20mm Aluminum Heatsink 4-Pack if
- You require a larger surface area for higher heat dissipation on GPUs or CPUs.
- You want a heatsink made from specific 6063-T5 aluminum for improved conductivity.
- You are cooling high-power devices like MOSFETs, power amplifiers, or routers.
Verdict: Choose the forty-millimeter heatsink if space is limited or your components generate less heat. Select the fifty-millimeter heatsink if you need greater thermal capacity for powerful chips like GPUs or MOSFETs. Both options provide reliable passive cooling through anodized aluminum construction.
40mm vs 50mm Heatsink Specs
Base footprint area
Product A measures forty by forty millimeters, giving it a base area of sixteen hundred square millimeters. Product B measures fifty by fifty millimeters, providing two thousand five hundred square millimeters of contact surface. A larger base spreads heat over more fins and a wider area. This helps dissipate thermal energy more effectively for components that generate moderate heat. If your component fits both sizes, the fifty-millimeter option offers more surface area for passive cooling. The extra nine hundred square millimeters can make a noticeable difference in thermal performance for power transistors or larger ICs.
Material grade
Product A uses standard anodized aluminum. Product B specifies 6063-T5 aluminum that is also anodized. The 6063-T5 alloy is a specific grade known for good thermal conductivity and improved mechanical strength compared to generic aluminum. This alloy is less prone to bending and scratching during handling and installation. For users who need durability alongside cooling performance, the specific alloy designation in Product B suggests a higher quality build. Standard aluminum works well, but the T5 temper adds structural integrity to the fins and base plate.
Weight per unit
Product A weighs 1.45 ounces per heatsink. Product B weighs 15 ounces per heatsink. This is a significant difference in mass. The heavier unit has more thermal mass, which can help absorb heat spikes before transferring it to the air. However, the lighter unit is easier to handle and install on smaller components. For passive cooling applications where the heatsink sits directly on a small chip, the lighter option may be sufficient. The heavier option is better suited for larger power devices that benefit from the extra material to buffer temperature changes.
Fin count
Product B includes fourteen fins per unit. Product A does not list a specific fin count in the provided data. A higher fin count generally increases the surface area available for air to flow over and cool the metal. More fins mean more contact with the ambient air, which improves passive cooling efficiency. Without the fin count for Product A, we cannot determine if it has fewer or more fins than the fourteen found in Product B. For maximum cooling surface area, the specified fourteen fins in Product B are a clear advantage.
Compatible devices
Product A lists compatibility with IC chips, NEMA17 stepper motors, TEC1-12706 coolers, and LED lights. Product B lists compatibility with GPU, CPU, LED chipset, router, power transistors, FETs, and MOSFETs. Product B covers a wider range of high-power electronic components. The inclusion of GPU and CPU suggests it is designed for higher thermal loads. Product A is focused on smaller electronics and 3D printer motors. If you are cooling a router or a power amplifier, Product B is the more versatile choice due to its broader compatibility list.
Which Awxlumv Heatsink Kit Suits You
Users needing maximum surface area for power components
Product B offers a fifty by fifty millimeter base, providing two thousand five hundred square millimeters of contact surface. This larger footprint allows for better heat dissipation across the entire base. The anodized 6063-T5 aluminum material ensures improved thermal conductivity. It is designed for passive cooling of larger components like voltage regulators and MOSFETs without requiring active airflow.
Users with limited space on compact electronic boards
Product A measures forty by forty millimeters, occupying only sixteen hundred square millimeters of board space. This compact footprint fits well in tight enclosures or on smaller PCBs. The twenty-millimeter height remains consistent with the larger model. It provides adequate passive cooling for standard IC chips and stepper motors where space is a primary constraint rather than raw thermal mass.
Users prioritizing lighter weight for portable builds
Product A weighs 1.45 ounces per unit, significantly lighter than the alternative. This reduced mass is beneficial for projects where weight matters, such as portable 3D printer modifications or lightweight electronic enclosures. The anodized aluminum finish still offers scratch resistance and durability. You get four units per package, maintaining the same quantity as the heavier option while minimizing overall system weight.
The products compared
Awxlumv 40mm Anodized Aluminum Heatsink 4-Pack
Best for: passive cooling of small ICs and motors
- Material
- Anodized aluminum
- Cooling Method
- passive cooling
- Compatible Device
- IC chip, NEMA17 stepper motors
- Dimensions
- 40 x 40 x 20mm
- Weight
- 1.45 ounces
View on Amazon: Awxlumv 40mm Anodized Aluminum Heatsink 4-Pack Affiliate link
This kit includes four 40x40x20mm anodized aluminum heatsinks designed for passive cooling. Each unit measures 1.57 by 1.57 by 0.79 inches and weighs 1.45 ounces. The smooth, burr-free surface helps dissipate heat from IC chips, NEMA17 stepper motors, and LED lights. You get a compact solution for small electronics. Thermal paste is not included, so you must supply your own adhesive or paste for installation.
Pros
- Anodized aluminum construction for durability
- Compact 40x40x20mm footprint
- Includes four units per package
- Smooth surface without burrs
Cons
- Passive cooling only, no fan support
- Thermal adhesive paste not included
- Smaller size than 50mm alternatives
Good fit if
- You need to cool small IC chips
- You are cooling NEMA17 stepper motors
- You require multiple small heatsinks
Skip if
- You need active fan cooling
- You require a 50mm footprint
- You want included thermal paste
Verdict: Awxlumv 40mm Anodized Aluminum Heatsink offers a practical passive cooling solution for small electronics like stepper motors. It suits builders who need multiple compact units for tight spaces.
Awxlumv 50x50x20mm Aluminum Heatsink 4-Pack
Best for: passive cooling of power modules and LED chipsets
- Material
- 6063-T5 aluminum anodized
- Cooling Method
- Passive
- Compatible Device
- GPU, CPU, LED Chipset, Router
- Dimensions
- 50mm x 50mm x 20mm
View on Amazon: Awxlumv 50x50x20mm Aluminum Heatsink 4-Pack Affiliate link
This kit includes four 50x50x20mm passive heatsinks made from 6063-T5 anodized aluminum. Each unit weighs 15 oz and features 14 fins with a flat base plate. The anodized finish resists scratches and bending. You get a larger footprint than the 40mm alternative. This size suits components needing more surface area for heat dissipation.
Pros
- 50mm x 50mm x 20mm dimensions provide ample surface area
- 6063-T5 anodized aluminum resists scratches and fin bending
- Flat base plate ensures solid contact with heat sources
- Includes four units for multiple component cooling
Cons
- Passive cooling only, no fan included
- Heavier build at 15 oz per unit
- Limited to low-power components like LED chipsets
Good fit if
- You need passive cooling for power transistors or MOSFETs
- You require a larger base than 40mm allows
- You are cooling multiple low-power components simultaneously
Skip if
- You need active cooling with a fan
- You have strict height constraints under 20mm
- You are cooling high-TDP CPUs without airflow
Verdict: Awxlumv 50x50x20mm Aluminum Heatsink 4-Pack is a solid choice for passive cooling applications requiring a larger base. It fits users cooling power modules or LED chipsets who need durability and surface area.
Specifications side by side
| Spec | Awxlumv 40mm Anodized Aluminum Heatsink 4-Pack | Awxlumv 50x50x20mm Aluminum Heatsink 4-Pack |
|---|---|---|
| Material | Anodized aluminum | 6063-T5 aluminum anodized |
| Cooling Method | passive cooling | Passive |
| Compatible Device | IC chip, NEMA17 stepper motors | GPU, CPU, LED Chipset, Router |
| Dimensions | 40 x 40 x 20mm | 50mm x 50mm x 20mm |
| Weight | 1.45 ounces | not stated |
| Size | 40*40*20mm | 4 Pcs |
| Color | 4Pcs | not stated |
| Model | 40x40x20mm Heatsink | 20-40mm |
Frequently asked questions
Can I use the 40mm heatsink for a GPU?
The 40mm Awxlumv heatsink is not listed for GPU use. It is best for passive cooling of small ICs and motors. You should choose the 50mm model for GPU applications. The larger footprint provides better heat dissipation for high-power components. Check your device compatibility before installing.
What is the height difference between the two kits?
Both heatsink kits share the same height of twenty millimeters. The 40mm and 50mm models are both 0.79 inches tall. The difference lies in the base width and length. You get a larger square base with the 50mm option. The height remains identical for mounting in similar spaces.
Are these heatsinks suitable for 3D printers?
Yes, the 40mm Awxlumv heatsink is compatible with 3D printers. It is designed for passive cooling of stepper motors and VRMs. The compact size fits well in tight printer enclosures. The 50mm model is less specified for this use. Verify your motor size before choosing the smaller kit.
How many heatsinks come in each pack?
Each Awxlumv kit includes four identical aluminum heatsinks. You receive a four-pack of the 40mm units or a four-pack of the 50mm units. This allows you to cool multiple components simultaneously. The quantity is consistent across both size options for your projects.
Is the material anodized aluminum for both sizes?
Both kits are made from aluminum. The 40mm model is explicitly described as anodized aluminum. The 50mm model is listed as aluminum. Anodizing improves durability and heat transfer. Both options provide passive cooling without fans. Ensure your surface preparation matches the material finish for optimal contact.
Which heatsink has a larger base area?
The 50mm Awxlumv heatsink has a larger base area. It measures fifty by fifty millimeters for two thousand five hundred square millimeters of contact. The 40mm model offers sixteen hundred square millimeters. A larger base spreads heat more effectively. Choose the 50mm size for higher thermal loads.
Can I mount these heatsinks vertically or horizontally?
These passive aluminum heatsinks can be mounted in either orientation. Their flat base allows secure attachment to flat surfaces. The twenty-millimeter height limits airflow in very tight spaces. Ensure good thermal paste application for efficient heat transfer. The compact design fits various device layouts without obstruction.